Title:
Mapping bonded wafer distortions to enable post-bonding overlay in DUV lithography
Abstract:
Heterogeneous integration of semiconductor technologies demands high-density, multi-material processing and advanced lithography tools for high precision. This is particularly challenging for double-sided processing on bonded wafers, where dissimilar materials cause structural distortions due to a mismatch in thermal expansion coefficients. Consequently, the spatial coordinates of pre-existing alignment markers shift, compromising overlay accuracy. In this talk, I will present our method to evaluate wafer-level distortions in Deep UV lithography systems (193 nm ArF projection scanner) and quantify overlay accuracy for post-bonding exposures.
Dr. Sara Sequeira
Sara Sequeira completed her Master’s degree in 2012, focusing on dye-sensitised solar cells. She obtained her PhD. at the University of Lisbon in 2023. Her project involved designing and implementing novel processes to micropattern organic materials for photodetectors. In 2022, she joined Eindhoven University of Technology as a Researcher, where she was involved in manufacturing photonic integrated circuits using III-V materials.