Title:
Printing the Future: The Journey from EUV to High-NA EUV Lithography

Abstract:
Every smartphone, AI accelerator, and high-performance processor begins with a patterning challenge. Today, that challenge is increasingly being addressed by Extreme Ultraviolet (EUV) lithography and, more recently,High-NA EUV. As the semiconductor industry pushes toward ever-smaller dimensions, lithography remains a key enabler of device scaling, performance, and manufacturing innovation.

This presentation explores the transition from conventional EUV to High-NA EUV lithography from a semiconductor manufacturing perspective. Key topics include imaging, materials, metrology, defectivity, and process control, highlighting the new opportunities and challenges introduced by higher numerical aperture imaging. Drawing on experiences from advanced patterning development, the talk will discuss the challenges, breakthroughs, and key learnings associated with the transition to High-NA EUV, and what this evolution means for the future of semiconductor technology. The presentation concludes with an outlook on the opportunities and remaining challenges facing the lithography community as the industry advances toward the next generation of semiconductor technologies.